Achieving a Higher Integration Level of Neuromorphic Hardware using Wafer Embedding

This thesis investigates the application of a chip packaging technology on a silicon wafer for a neuromorphic hardware system. The procedure embeds a complete silicon wafer into a printed circuit board (PCB). The embedding procedure was developed together with the Fraunhofer Institute for Reliability and Microintegration in Berlin. At first bare silicon disks were embedded into PCBs to find the correct material selection and the suitable stack up. Finally, the HICANN wafers of the Electronic Visions Group, which are employed in the BrainScaleS system, were embedded into PCBs. For that reason 20 cm wafers are thinned down to 250 μm and the redistribution layer (RDL) pads get an additional copper layer. The Deep EvolutioN in System Embedding (DENSE) board has two copper layers and uses microvias for the connections to the wafer. Existing software of the BrainScaleS system is used to test and characterize the DENSE board. The tests cover the communication to the wafer and the functionality of the analog parameter storage and the neuron circuits. It is shown that the embedding process has no influence on the circuits and on the RDLs of the wafer. Additionally, the long-term reliability of the board was tested in a climate cabinet by conducting an accelerated environmental stress test. No failures were observable on the DENSE board

Full Wafer Redistribution and Wafer Embedding as Key Technologies for a Multi-Scale Neuromorphic Hardware Cluster

Together with the Kirchhoff-Institute for Physics(KIP) the Fraunhofer IZM has developed a full wafer redistribution and embedding technology as base for a large-scale neuromorphic hardware system. The paper will give an overview of the neuromorphic computing platform at the KIP and the associated hardware requirements which drove the described technological developments. In the first phase of the project standard redistribution technologies from wafer level packaging were adapted to enable a high density reticle-to-reticle routing on 200mm CMOS wafers. Neighboring reticles were interconnected across the scribe lines with an 8{\mu}m pitch routing based on semi-additive copper metallization. Passivation by photo sensitive benzocyclobutene was used to enable a second intra-reticle routing layer. Final IO pads with flash gold were generated on top of each reticle. With that concept neuromorphic systems based on full wafers could be assembled and tested. The fabricated high density inter-reticle routing revealed a very high yield of larger than 99.9%. In order to allow an upscaling of the system size to a large number of wafers with feasible effort a full wafer embedding concept for printed circuit boards was developed and proven in the second phase of the project. The wafers were thinned to 250{\mu}m and laminated with additional prepreg layers and copper foils into a core material. After lamination of the PCB panel the reticle IOs of the embedded wafer were accessed by micro via drilling, copper electroplating, lithography and subtractive etching of the PCB wiring structure. The created wiring with 50um line width enabled an access of the reticle IOs on the embedded wafer as well as a board level routing. The panels with the embedded wafers were subsequently stressed with up to 1000 thermal cycles between 0C and 100C and have shown no severe failure formation over the cycle time.Comment: Accepted at EPTC 201

Accelerated physical emulation of Bayesian inference in spiking neural networks

The massively parallel nature of biological information processing plays an important role for its superiority to human-engineered computing devices. In particular, it may hold the key to overcoming the von Neumann bottleneck that limits contemporary computer architectures. Physical-model neuromorphic devices seek to replicate not only this inherent parallelism, but also aspects of its microscopic dynamics in analog circuits emulating neurons and synapses. However, these machines require network models that are not only adept at solving particular tasks, but that can also cope with the inherent imperfections of analog substrates. We present a spiking network model that performs Bayesian inference through sampling on the BrainScaleS neuromorphic platform, where we use it for generative and discriminative computations on visual data. By illustrating its functionality on this platform, we implicitly demonstrate its robustness to various substrate-specific distortive effects, as well as its accelerated capability for computation. These results showcase the advantages of brain-inspired physical computation and provide important building blocks for large-scale neuromorphic applications.Comment: This preprint has been published 2019 November 14. Please cite as: Kungl A. F. et al. (2019) Accelerated Physical Emulation of Bayesian Inference in Spiking Neural Networks. Front. Neurosci. 13:1201. doi: 10.3389/fnins.2019.0120

Pattern representation and recognition with accelerated analog neuromorphic systems

Despite being originally inspired by the central nervous system, artificial neural networks have diverged from their biological archetypes as they have been remodeled to fit particular tasks. In this paper, we review several possibilites to reverse map these architectures to biologically more realistic spiking networks with the aim of emulating them on fast, low-power neuromorphic hardware. Since many of these devices employ analog components, which cannot be perfectly controlled, finding ways to compensate for the resulting effects represents a key challenge. Here, we discuss three different strategies to address this problem: the addition of auxiliary network components for stabilizing activity, the utilization of inherently robust architectures and a training method for hardware-emulated networks that functions without perfect knowledge of the system's dynamics and parameters. For all three scenarios, we corroborate our theoretical considerations with experimental results on accelerated analog neuromorphic platforms.Comment: accepted at ISCAS 201

From clean room to machine room: commissioning of the first-generation BrainScaleS wafer-scale neuromorphic system

The first-generation of BrainScaleS, also referred to as BrainScaleS-1, is a neuromorphic system for emulating large-scale networks of spiking neurons. Following a ‘physical modeling’ principle, its VLSI circuits are designed to emulate the dynamics of biological examples: analog circuits implement neurons and synapses with time constants that arise from their electronic components’ intrinsic properties. It operates in continuous time, with dynamics typically matching an acceleration factor of 10 000 compared to the biological regime. A fault-tolerant design allows it to achieve wafer-scale integration despite unavoidable analog variability and component failures. In this paper, we present the commissioning process of a BrainScaleS-1 wafer module, providing a short description of the system’s physical components, illustrating the steps taken during its assembly and the measures taken to operate it. Furthermore, we reflect on the system’s development process and the lessons learned to conclude with a demonstration of its functionality by emulating a wafer-scale synchronous firing chain, the largest spiking network emulation ran with analog components and individual synapses to date